SiP DFM Process Engineer

Summary

Posted: Feb 18, 2025

Weekly Hours: 40

Role Number:200586141

Imagine what you could do here. At Apple, new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there’s no telling what you could accomplish. The people here at Apple don’t just create products — they create the kind of wonder that’s revolutionized entire industries. It’s the diversity of those people and their ideas that inspires the innovation that runs through everything we do, from amazing technology to industry-leading environmental efforts. We are seeking an experienced professional with expertise in the area of semiconductor packaging processes. This engineer will assist in the development of assembly and packaging process for SiP (System-in-package) modules and MLBs. The successful engineer in this role will be able to work at contract manufacturer sites, interacting closely with suppliers to deliver scalable manufacturing processes in a timely manner.

Description

Work with external contract manufacturers and Apple engineers to develop SMT, molding and saw processes/solutions collaborating closely with suppliers for semiconductor packaging equipment and material vendors. Provide engineering support for product builds at the factory, do data analysis and FA, report build status. Conduct factory audit, monitor and drive closure of any yield and reliability issues with factory. Work with Operations group and the extended supply chain to address production ramp and MP needs.

Minimum Qualifications

• 7+ years experience with SMT (surface mounting technology), underfill, molding, dicing saw, all in the context of high-volume semiconductor/packaging/electronics manufacturing.
• B.S in Materials Science, Chemical Engineering, Physics, Mechanical Engineering, or related fields

Preferred Qualifications

• Prior experience with development and qualification of semiconductor packages a plus
• Good understanding and skill for material characterizations, semiconductor packaging, component failure analysis, design for experiments, and data analysis.
• Ability to work with a wide range of people with varying degrees of experience.
• Excellent communication skills.

Pay & Benefits

• At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $136,300 and $205,500, and your base pay will depend on your skills, qualifications, experience, and location.
  
  Apple employees also have the opportunity to become an Apple shareholder through participation in Apple’s discretionary employee stock programs. Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple’s Employee Stock Purchase Plan. You’ll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses — including tuition. Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation. Learn more about Apple Benefits.
  
  Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.